Method for testing plurality of system-in-package devices using plurality of test circuits

ABSTRACT

A method for testing System-In-Package (SIP) devices such as micro SD devices each having a plurality of electrical leads is described. The method utilizes industry standard JEDEC trays and tests all devices in such trays at the same time.

FIELD OF THE INVENTION

The invention relates to the testing of electronic devices, in general,and to electrical testing of system-in-package devices disposed inindustry standard processing trays, in particular.

BACKGROUND OF THE INVENTION

As the complexity of semiconductor devices increases, more and more theuse of “system-in-package” (SIP) device assemblies are being utilized.With increasing complexity of systems, SIPs are becoming more desirablethan “system-on-chip” (SOC) because the cost with respect to functionand time to market increase dramatically with complexity of the system.The growth in use of SIP devices is being driven by the price sensitivewireless, consumer and automotive markets.

Examples of devices being implemented as SIP devices include: cellulardevices, PDAs, handheld devices, Bluetooth™ solutions, flash memory,image sensors, power amplifiers, GPS modules, and mini-SD (securedigital) devices.

A SIP device in one formulation may be a module that is a fullyfunctional subsystem package comprising a substrate, one or more die,chip-level interconnects, integrated or surface-mounted passive andactive components, and a protective casing.

A SIP device in another formulation may be a stacked-die assembly thatutilizes a standard package incorporating two or more vertically stackeddie, and chip-level interconnects on a substrate.

A SIP device in a further formulation may be a multi-chip module thatutilizes a standard package incorporating two or more horizontallyarranged die and chip-level interconnects on a substrate.

A SIP device in yet a further formulation may be a combination ofstandard prepackaged devices stacked vertically with package-levelinterconnects.

The use of SIP devices raises significant changes from a testingviewpoint. SIP devices place emphasis on the use of “known good die”before packaging. The product lifetime for SIP devices will becomeshorter. SIP devices provide much less access to testing points. Highthroughput testing is required for cost minimization. The demand is forlow cost testing.

The use of “known good die” will most likely lead to the conclusion thatthere is little need to retest dies.

Less access to test points means that traditional final tests on SIPdevices will not be possible.

The increasing use of SIP devices in consumer electronics leads to theconclusion that low testing cost is crucial.

For all these reasons, traditional automatic test equipment testingmodels are not the best approach for testing SIP devices.

Current automatic test equipment solutions that are low in cost have lowtest throughput. In addition, most of the automatic test equipmentapproaches utilize a separate handler that picks parts from processingtrays and tests the picked parts.

It is desirable to provide a testing solution for SIP devices that doesnot utilize separate a handler separate from a tester.

It is also desirable to provide a testing solution that has a highthroughput.

It is further desirable to provide a low cost testing solution thatutilizes scalable handler and tester modules that are re-usable fordifferent platforms.

SUMMARY OF THE INVENTION

A method for testing System-In-Package (SIP) devices each having aplurality of electrical leads is provided in accordance with theprinciples of the invention. The method includes the steps of:

-   -   receiving the SIP devices in industry standard device processing        trays having a plurality of SIP device receiving cells;    -   forming a stack of the trays of SIP devices;    -   orienting the stack of the trays such that contacts on each of        the devices are in a predetermined orientation;    -   providing a test hive having a plurality of test circuits        corresponding in number to each of the cells and providing a        plurality of groups of test contacts, each group of test        contacts being coupled to one of said test circuits and being        oriented to engage the plurality of electrical leads of a SIP        device disposed in a corresponding one of the cells;    -   moving each tray from the stack one at a time to a position        proximate a test hive;    -   causing relative movement of the tray proximate the test hive        whereby the test hive engages the tray of SIP devices and the        test hive such that electrical connection is made simultaneously        by each of the groups of test contacts with the electrical leads        of a SIP device disposed in the corresponding one of the cells;        and    -   simultaneously electrically testing all of the SIP devices in        each tray engaged by the hive.

Further in accordance with the method of the invention, the results ofthe testing of all SIP devices in each tray are mapped.

Still further in accordance with the principles of the invention, themethod comprises:

-   -   providing the test hive with a first member configured to        receive each tray engaged by the hive; and    -   including a plurality of alignment surfaces on the first member        to provide alignment of each tray engaged by the hive to adjust        for dimensional tolerance differences of each the tray.

In the illustrative method of the invention the method includes:providing the hive with a base plate comprising a second plurality ofalignment surfaces each associated with a corresponding one of the cellsto provide alignment of each SIP device in each corresponding one of thecells.

Further in accordance with aspects of the invention, the SIP devicescomprise micro SD devices.

In accordance with the principles of the invention a testing system forSystem In Package (SIP) devices each having a plurality of electricalleads is provided. The system comprises a loader module receiving astack of industry standard device processing trays each having aplurality of SIP device receiving cells. The stack of trays is orientedsuch that contacts on each of the SIP devices are in a predeterminedorientation. A test hive comprises a plurality of test circuitscorresponding in number to each of the cells and a plurality of groupsof test contacts. Each group of test contacts is coupled to one of thetest circuits and is oriented to engage the plurality of electricalleads of a SIP device disposed in a corresponding one of the cells.First tray handling apparatus is configured to move each tray from thestack one at a time to a position proximate a test hive. Second trayhandling apparatus causes relative movement of the tray proximate thetest hive whereby the test hive engages the tray of SIP devices and thetest hive such that electrical connection is made simultaneously by eachof the groups of test contacts with the electrical leads of a SIP devicedisposed in the corresponding one of the cells. Control apparatus isprovided. The control apparatus simultaneously electrically testing allof the SIP devices in each tray engaged by the hive via the testcircuits.

Still further in accordance with the principals of the invention a firstmember is provided in the test hive to receive each tray engaged by thehive. The first member includes a plurality of alignment surfaces toprovide alignment of each tray engaged by the hive to adjust fordimensional tolerance differences of each tray.

Even further in accordance with the principles of the invention the hivecomprises a base plate that comprises a second plurality of alignmentsurfaces each associated with a corresponding one of the cells toprovide alignment of each SIP device in each corresponding one of thecells.

BRIEF DESCRIPTION OF THE DRAWING

The invention will be better understood from a reading of the followingdetailed description of an illustrative embodiment of the invention inconjunction with the drawing figures in which like referencedesignations identify like elements, and in which:

FIG. 1 illustrates a JEDEC tray with micro SD devices in a “live bug”configuration;

FIG. 2 illustrates a JEDEC tray with micro SD devices in a “dead bug”configuration;

FIG. 3 illustrates a portion of a JEDEC tray partially populated withmicro SD devices;

FIG. 4 is a perspective view of a system in accordance with theprinciples of the invention;

FIG. 5 is a top view of the system of FIG. 4;

FIG. 6 is a front view of the system of FIG. 4;

FIG. 7 is an end view of the system of FIG. 4;

FIG. 8 is a perspective view of the tray transport arrangement;

FIG. 9 is a perspective view of the tray transport arrangement showingtwo JEDEC trays in positions;

FIG. 10 is a perspective view of a portion of the system of FIG. 4;

FIG. 11 is a perspective view of the hive assembly of the system of FIG.6;

FIG. 12 is an exploded perspective view of the hive assembly;

FIG. 13 is an exploded perspective view of a portion of the hiveassembly;

FIG. 14 is a top planar view of the hive assembly;

FIG. 15 is a top planar view of the pogo pin board of the hive assembly;

FIG. 16 is an exploded perspective view of a portion of the hiveassembly;

FIG. 17 is top view of a portion of the hive assembly with a JEDEC tray;

FIG. 18 is a perspective view of a portion of the hive assembly withJEDEC tray;

FIGS. 19-22 show operation of a portion of the hive assembly in closeup;

FIG. 23 is a bottom perspective view of an alternate portion of the hiveassembly; and

FIG. 24 is an exploded bottom perspective view of the alternate portionof FIG. 23.

DETAILED DESCRIPTION

Semiconductor products require testing at various stages of the assemblyprocess. The test process can either be at a wafer level or packagelevel. “Burn-in” testing can be at the wafer and package level. Themethods for contacting the devices at the different stages are many.This is done both in a single device as well as devices in parallel. Theneed for testing more than one device at a time is driven by test time,device volume, equipment costs, etc.

At the wafer level, the contact method can either be a cantilever probewire contact or a vertical probe such as a coil spring pogo pin. Waferprobes are used to index a wafer in x-y directions moving the waferunder a set of fixed contacts using a machine vision camera to align thewafer pads to the probe contacts. When the device is still in the waferform, the location of the pads both within the die and from die to dieis as accurate as the wafer process itself. When the probe aligns to onedie, accurate, repeatable steps from one to another is all that isneeded. Parallel processing of devices in a wafer is a matter ofmanufacturing a probe contact array which has accuracy which matches thewafer contact pattern.

At the package level, after the devices are cut and singulated from thewafer they are wire bonded to leads or connected to solder balls in thecase of a BGA (ball grid array). Devices which are at a package levelare usually handled and tested using test handlers which depending onthe nature of the package is usually done with a pick and place handler.

During the manufacture of micro SD devices, processing trays, alsoreferred to as component trays, in-process trays, or carrier trays aretypically used throughout many phases of production for handling microSD devices.

A commonly used processing tray design widely used within thesemiconductor industry for handling micro SD devices during productionis the JEDEC tray. JEDEC trays, such as those shown in FIGS. 1 and 2,are designed and manufactured to comply with standards established bythe Joint Electronic Device Engineering Counsel (JEDEC). Generally, aJEDEC tray includes a grid-like, open lattice structure that forms aplanar, two-dimensional array of device cells. Each device cell isadapted to hold a single micro SD device. JEDEC trays are usuallyinjection molded from plastic and vary in overall dimensions and gridsize depending on the type of IC device the tray is designed to hold.JEDEC trays are stackable and also have surface features, such aslocating and hold-down tabs, that facilitate manipulation of the traysby automatic processing and testing equipment.

Micro SD devices are placed into JEDEC trays and moved through thefactory and often shipped in the JEDEC tray. These trays are consideredshipping trays and have features in them which keep the parts separatedfrom one another in a grid. Most device handlers have various inputcapabilities such a cassette, tube, or JEDEC tray input and output.Typical processing of micro SD devices is to unload all of the devicesfrom the transport media, and placed into more dimensionally controlledhandling assemblies such as shuttles, precisers and plungers. The microSD device is then interfaced with an automatic test equipment (ATE)electrical tester, by being inserted into a test fixture also known as a“nest” or interposer, which also has built in alignment features whichfurther aid in making contact with the test contacts. All micro SDdevices whether good or bad are taken out of the JEDEC tray, tested, andplaced back into the JEDEC tray.

Electrical testing is a procedure used to verify that micro SD devicesfunction according to their minimum rated specifications and, in someinstances, to classify devices based on their operating characteristics.In electrical testing, a more complete set of operating electricalsignals is supplied to the devices to provide a thorough evaluation oftheir functions. After electrical testing, the devices may be sorted,based on a device's electrical characteristics exhibited under test,into categories or “bins” according to a predetermined set ofperformance characteristics.

Semiconductor device package orientation is usually described as either“live bug” or “dead bug” depending on which side the leads are on. Thelive bug orientation is an orientation in which the leads 105 a that areon the bottom of the device 105 are facing downward as shown in FIG. 1.In FIG. 1 the JEDEC tray 101 has a plurality of SIP device receivingcells 103. Each device receiving cell 103 is sized to receive a device105 which in the illustrative embodiment is in a live bug orientation.In the illustrative embodiment of the invention, device 105 is a microSD memory.

The dead bug orientation is an orientation in which the device 105 isturned over with the leads 105 a facing upward. The orientation ofdevices 105 in a JEDEC tray 101 is typically “live bug,” because the enduser of the device 105 may use a pick and place machine to place thedevice on a printed circuit board (“PCB”).

Micro SD memory 105 devices which are “live bug” oriented in a JEDECtray have the leads facing downward toward the tray. This makes itdifficult or impossible to gain access to the contacts 105 a fortesting.

The design of JEDEC trays is such that each tray 101 is identical butthe upper surface 101 a and the lower surface 101 b of each tray isconfigured differently. When JEDEC trays are stacked, the top trayprovides additional control to the part in the lower tray, it is thesefeatures which allows the tray to be turned over, while two trays aretogether, basically transferring all of the devices from the bottom trayto the top tray when flipped, which then of course, becomes the newbottom tray.

When the JEDEC trays 101 are flipped, the device contacts 105 a areexposed because the devices 105 are now in the dead bug orientation asshown in FIG. 2. Each JEDEC tray101 has additional depth on the bottomof the tray, which provides addition room for alignment features toprotrude into.

Micro SD device contacts can be solder balls, leads or gold contact pads105 a. The pitch of these contacts 105 a can be small and also the widthof the pads may be small. It is necessary to connect with each pad witha contact 105 a which is connected with the tester.

A JEDEC tray 101 is usually a molded plastic tray which while beingrepeatable in accuracy is subject to the typical tolerance issues of amolded part such as a dirty or worn out tool set. The behavior of amolded tray 101 is that the molded part variation will also come frommold shrinkage by percentage. For a JEDEC tray 101, because of itsrectangular shape, the variation is more of an issue in the x directionalong the length than in the y direction along the width.

To simultaneously contact all devices 105 on a JEDEC tray 101 severaltolerance stacks or build ups are taken into consideration. They are theminimum and maximum dimensions of each micro SD device, the minimum andmaximum dimensions of each cell or tray pocket, as well as the minimumand maximum outer dimensions of the tray. In accordance with theprinciples of the invention aligning features are provided that allowfor the shift which can occur as a result of all these tolerances.

FIG. 3 shows a JEDEC trays 101 with cells 103 for micro SD devices 105that are in a dead bug orientation with contacts 105 on the top and alsoshowing minimum sized, nominally sized and maximum sized micro SDdevices 105.

FIGS. 4 through 7 show different views of a system 1000 in accordancewith the principles of the invention that provides for testing in JEDECtrays of micro SD devices, in which a whole tray of devices is testedwithout removal of the micro SD devices from the tray.

System 1000 includes loader module 1100, a tester module or hive 1300, asorter module 1500, un-loader module 1700 and tray handlers 1900. Afirst transport arrangement 2100 is provided to move trays for theloader module 1100 to hive 1300 and from hive 1300 to sorter module1500. A second transport arrangement 2200 is provided to move trays fromsorter module 1500 to un-loader module 1700. It will be appreciated bythose skilled in the art that the first and second transportarrangements may be combined into or replaced by a single transport unitin alternate embodiments of the invention.

JEDEC trays are loaded as a stack onto loader module 1100. Loader module1100 includes vertical supports 1101 that position the stack of JEDECtrays. Disposed below the vertical supports is the first transportarrangement 2100 as shown best in FIGS. 21 and 22. First transportarrangement is a conveyer type transport that comprises rails 2101 and2103. Rail 2101 includes a flange 2105. Rail 2103 includes a flange2107. Flanges 2105 and 2107 form a track upon which JEDEC trays aremoved from the loader module 1100 to a position disposed below hive1300. Flanges 2105 and 2107 are disposed below the top surface of rails2101 and 2103, respectively.

A pair of belts 2109, 2111 are disposed below and proximate to flanges2105 and 2107, respectively. Each belt 2109, 2111 carries tabs 2115,2117 extending vertically therefrom and of such a length so as to extendabove flanges 2105, 2107 and to engage the end of a JEDEC tray 101supported by flanges 2105, 2107. With this arrangement, staticelectricity buildup is minimized since a common source of staticelectricity buildup in conveyor transport of trays.

Disposed below loader module 1100 is a first tray handler 1900. Firsttray handler 1900 is described in greater detail below. First trayhandler 1900 includes a lift plate 1901 that is raised and lowered bymotor 1909. Lift plate 1900 is sized such that it fits between flanges2105, 2107. When a stack of JEDEC trays is placed onto loader module1100, the bottom of the stack of trays rests on solenoid actuated bladesupports 1102, each disposed on a corresponding one vertical support1101. Only blade supports 1102 on the rear vertical supports 1101 areshown in the drawings. When a tray is to be moved from the loadermodule, first tray handler 1900 is actuated so as to raise plate 1901into engagement with the bottom of the lowest tray in a stack. Bladesupports 1102 then retract. The bottom tray is lowered by first trayhandler onto flanges 2105, 2107. As the bottom tray is lowered by firsttray handler 1900, blade supports 1102 are operated to engage andsupport the tray above the bottom tray.

After the bottom tray is lowered onto flanges 2105, 2107, the tray willbe moved into position below hive 1300 by tabs 2117 engaging the rear ofthe tray and sliding the tray into position below hive 1300.

Tester module or hive 1300 and its key component elements are shown inFIGS. 11 through 18. Hive 1300 includes tester 1310, contactor base 1350and outer frame 1370.

The construction of hive 1300 is in a downward facing configuration toallow a JEDEC tray 101 to be raised into the hive 1300 or alternativelyhive 1300 can be lowered over tray 101. Outer frame 1370 has a trayreceiving cavity 1371 with tapered inside edges 1373 to guide theoutside edges of the tray 101 to allow for a medium alignment of thedevices 105.

Frame 1370 is mounted to a contactor base 1350 which is non-conductivematerial. Contactor baser 1350 has contacts mounted within. Eachcontact, better seen in FIGS. 19 through 22 is a “Pogo” pin 1351. EachPogo pin 1351 is a spring loaded contactor pin of a type known in theart. Pogo pins 1351 are arranged in a matrix arrangement thatcorresponds to the placement of device leads 105 a for a fully populatedJEDEC tray 101.

An array of fine alignment features are integrated into base 1350 toprovide the final alignment of all of the devices 105 to contacts 1351.Specifically, guide pins 1353 having guide surfaces 1355 are disposed soas to be in alignment with each cell 103 of a JEDEC tray 101 and to urgeeach corresponding device 105 to a predetermined position regardless ofthe tolerance dimensions of the JEDEC tray 101 or the tolerancedimensions of each device 105. Contactor base 1350 includes slots 1357on its surface that is proximate JEDEC trays 101.

An alternate embodiment of the contactor base 1350 is shown in FIGS. 23and 24. In this alternate embodiment, contactor base 1350 is oftwo-piece construction comprising an insulating or first base portion1361 carrying the contactors or “Pogo” pins and a preferably metallicsecond base portion 1365 that has alignment pins 1353 carried thereon.First base portion 1361 includes rows of downwardly extending ribs 1363.Each rib 1363 carries a plurality of groups of contactor or “Pogo” pins1351 and provides an insulating support for the pins. Second baseportion 1365 includes a plurality of elongated apertures or throughslots configured and sized to receive the ribs 1363. Second base portion1365 includes alignment pins 1353 integrally formed thereon. Oneadvantage of the embodiment shown in FIGS. and 24 is that the life ofcontactor base 1350 is improved by utilizing a metallic portion so thatwear effects on alignment pins 1353 is reduced.

Second base portion 1365 also includes slots 1357 that are utilized toprovide clearance for tray retainers 2119 and 2121 shown in FIGS. 8 and9.

A JEDEC tray 101 populated with micro SD devices 105 in a dead bugconfiguration is raised by a second tray handler 1900. Second trayhandler 1900 raises JEDEC tray 101 as shown in FIGS. 19 through 22 sothat the tray with the devices 105 to be tested is first moved intoposition by edges 1373 of tray 1370. As JEDEC tray 101 is raised by trayhandler 1900 to a test position, each device 105 to be tested is movedto a predetermined position by guide surfaces 1355 of guide pins 1353 asmost clearly seen in FIGS. 19 and 20.

As most evident in FIG. 22, tray handler 1900 raises JEDEC tray 101 to adevice test position at which all Pogo pins 1351 carried by contactorbase 1350 engage contacts 105 a of each device 105. Each Pogo pin 1351is compressed and electrical contact is made by each Pogo pin 1351 tothe corresponding contact 105 a. Tray handler 1900 provides pressure tothe bottom of JEDEC tray 101 that is equivalent to the force required tocompress Pogo pins 1351. With the configuration provided, each Pogo pin1351 contacts its corresponding device 105 at the same time.

Once JEDEC tray 101 is moved to the test position, all devices 105 inJEDEC tray 101 are tested simultaneously. Testing of devices 105 isperformed by utilizing tester 1310. Tester 1310 as best seen in FIGS. 11and 12 includes a plurality of test modules 1311. The test modules 1311each are carried in a connector 1313. Each connector 1313 is carried ona circuit board 1312. The number of test modules 1311 and the number ofconnectors 1313 carried on circuit board 1312 correspond to the numberof rows of cells 103 of the JEDEC tray 101. Each connector 1313 isconnected to corresponding groups of Pogo pins 1351 via metallic tracescarried on circuit board 1312. Each group of Pogo pins corresponds, inturn, to a corresponding cell 103 in a row.

Each test module 1311 comprises a circuit board that includes a secondplurality of identical electronic circuits 1315. Each circuit 1315 isidentical and is configured to test one device 105 carried in JEDEC tray101. The number of circuits 1315 carried by a test module 1311 is equalto the number of cells 103 in a row of JEDEC tray 101. By way ofexample, JEDEC tray 101 shown in the drawings is arranged as 15 rows ofcells, each row containing eight cells. The corresponding tester 1310shown in the drawing figures includes fifteen test modules 1311 and eachtest module 1311 includes eight circuits 1315.

Advantageously, the test hive 1300 is utilized to test all the devices105 carried in a standard JEDEC tray 101 with the devices in the tray.

First transport arrangement 2100 includes retainer bars 2119, 2121. Eachretainer bar 2119, 2121 is positioned so that when a tray 101 ispositioned below test hive 1300, retainer bars 2119, 2121 will engagethe upward facing surface of the tray as the tray is raised into atesting position by second tray handler 1900. Retainer bars 2119 and2121 are retained in position by guide pins 2121, 2125, respectively.Although not seen in the drawing figures, each retainer bar 2119, 2121has a pair of guide pins 2121, 2125 with each guide pin in a pair beingdisposed on opposite ends of retainer bars 2119, 2121. Guide pins 2121,2125 are biased to a position such that as second tray handler 1900raises a tray, retainer bars 2119, 2121 provide forces against the trayto urge the tray into contact against plate 1901 of second tray handler1900. Contactor plate 1350 includes grooves 1357 which receive retainerbars 2119, 2121 such that retainer bars 2119, 2121 do not interfere with“Pogo pins” 1351 carried by contactor plate 1350. Retainer bars 2119,2121 assure that any warpage in trays 101 is eliminated by urging thetrays against plate 1901 and also assure that each tray cleanlydisengages from contact with contactor plate 1350 upon completion oftesting.

Turning back to FIGS. 6 through 9, test system 1000 receives a stack ofJEDEC trays. The stack if JEDEC trays 101 are turned upside down so thatthe device configuration in each of the trays is a dead bugconfiguration. In the illustrative embodiment of the system, each deviceis a micro SD device. The upside down stack of JEDEC trays is loadedinto a loader module 1100. A tray handler 1900 is disposed below loadermodule 1100 and is utilized to transfer JEDEC trays, one at a time totest hive 1300. Test hive 1300 in system 1000 is stationary. When a tray101 is moved to position under hive 1300, a second tray handler 1900 isutilized to raise JEDEC tray 101 into engagement with the test hive 1300whereupon testing of all devices is initiated.

As testing is performed, a map of each tray is made showing the testresults for each device. The test results may include characterizationof the type of test failure for failed devices. Second tray handler 1900lowers JEDEC tray 101 from the test position onto rails 2105, 2107.Belts 2109, 2111 are operated such that tabs 2115, 2117 engage the rearedge of JEDEC tray 101 and move the tested JEDEC tray from its positionunder hive 1300 unto second transport arrangement 2200 to a sortingmodule 1500 as best seen in FIGS. 6 and 7. The tested tray is placed inposition 1501.

The first tested tray is moved to position 1503 and the devices that didpass electrical testing (“good devices”) are utilized to replace devicesthat fail testing in subsequent trays. Once all devices from the tray atposition 1503 are removed, a new tested tray is moved to position 1503.The movement of the first tested tray to position 1503 may beaccomplished by any of a number of known apparatus and methods. Sortingmodule 1500, controlled by electronics modules 1950 utilizing the mapidentifying devices that failed testing, utilizes a pick-up arm 1507 tolift devices that did not pass electrical testing (a “failed device”)from the JEDEC tray at position 1503 to an initially empty tray forfailed devices at position 1505. Once all failed devices are removedfrom the JEDEC tray at position 1503, only good devices or devices thatdid pass electrical testing remain in the tray at position 1503.

The next JEDEC tray that completes testing is transported to the sortingmodule 1500 at position 1501. Pick up arm 1507 is utilized to removeeach failed device from the JEDEC tray at position 1501 to the JEDECtray at position 1505. The vacant positions in the tray at position 1501are each populated with devices from the JEDEC tray at position 1503.The devices in the JEDEC tray at position 1503 are utilized to replacethe failed devices removed from the JEDEC tray at position 1501 by againutilizing pick-up arm 1507. The removal of failed devices andrepopulating with good devices continues until the tray at position 1501is fully populated with all good devices. Once the JEDEC tray atposition 1501 is fully populated with good devices, second transportarrangement 2200 moves the JEDEC tray to the un-loader module 1700. Inthis manner, a JEDEC tray is provided that contains 100% tested gooddevices. The failed devices are separated and placed into a JEDEC trayat position 1505.

Second transport arrangement 2200 is constructed similar to the firsttransport arrangement in that it includes a pair of rails 2201, 2203which each carry a respective flange 2205, 2207. A belt 2209 is disposedbelow the upper surface of flanges 2205, 2207 and has tabs 2217extending therefrom that are used to engage the rear edge of a JEDECtray. In the embodiment shown, only one belt 2209 is utilized in thesecond transport arrangement 2200.

Second transport arrangement 2200 moves each JEDEC tray 100% populatedwith devices that pass testing to un-loader module 1700. Although thespecific structural details of the un-loader module 1700 are not shown,the structure is substantially the same as the loader module 1100.Un-loader module 1700 includes vertical supports 1701 that positiontrays into a stack of JEDEC trays. Disposed below un-loader module 1700is a third tray handler 1900. Third tray handler 1900 operates in thesame manner as the first and second tray handler. Third tray handler1900 includes a lift plate 1901 that is raised and lowered by a motor1909. Lift plate 1900 is sized such that it fits between flanges 2205,2207.

When a JEDEC tray is moved into position in un-loader module 1700, thirdtray handler 1900 raises the tray. The JEDEC trays are each raised to aposition that lifts any trays above until the bottom of the stack oftrays is proximate solenoid actuated blade supports, each disposed on acorresponding one vertical support 1701. As the tray is lifted intoengagement with the bottom of the stack, the blade supports retractallowing the bottom of the tray to be raised above the plane of theblade supports. The blade supports then extend to support the bottom ofthe bottom tray of the stack and the third tray handler 1900 lowers theplate 1901 to its rest position.

Although only one JEDEC tray position is shown at position 1505, otherembodiments of the invention can include multiple tray positions 1505for failed devices so that the failed devices may be sorted inaccordance with a predetermined criteria.

In other embodiments of the invention additional test hives 1300 may beprovided and each test hive may test a portion of the devices 105 in aJEDEC tray, or alternatively may be used to test an electrical portionof each device in a JEDEC tray. These alternate arrangements may beutilized to increase testing throughput.

In addition, a map of the test results for each device that passed thetests may be maintained. All mapping as well as control of system 1000are provided by electronics modules 1950 which include a microprocessormodule, memory module, test interfaces and associated electronics.

The invention has been described in terms of a specific embodiment. Itis not intended that the invention or the claims appended hereto belimited to the illustrative embodiment shown and described. It will beapparent to those skilled in the art that various changes andmodifications may be made to the embodiments without departing from thespirit or scope of the invention. Accordingly, the invention should belimited only by the scope of the claims appended hereto.

1. A method for testing System In Package (SIP) devices each having aplurality of electrical contacts, comprising: receiving said SIP devicesin industry standard device processing trays having a plurality of SIPdevice receiving cells; forming a stack of said trays of SIP devices;orienting said stack of said trays such that said contacts on each ofsaid devices are in a predetermined orientation; providing a test hivehaving a plurality of test circuits corresponding in number to each ofsaid cells and providing a plurality of groups of test contacts, each ofsaid group of test contacts being coupled to one of said test circuitsand being oriented to engage said plurality of electrical contacts of aSIP device disposed in a corresponding one of said cells; moving eachsaid tray from said stack one at a time to a position proximate saidtest hive; causing relative movement of said tray proximate said testhive whereby said test hive engages said tray of SIP devices such thatelectrical connection is made simultaneously by each of said groups oftest contacts with said electrical contacts of a SIP device disposed insaid corresponding one of said cells; and simultaneously, electricallytesting all of said SIP devices in each tray engaged by said hivewithout removing said SIP devices from said tray.
 2. A method inaccordance with claim 1, comprising: identifying each said SIP device ina tested tray of SIP devices according to electrical testing results. 3.A method in accordance with claim 2, comprising: causing relativemovement of said tray proximate said test hive whereby said test hivedisengages said tray of electrically tested said SIP devices.
 4. Amethod in accordance with claim 3, comprising: transporting each saiddisengaged tray of electrically tested SIP devices to a sorter module.5. A method in accordance with claim 4, comprising: providing at saidsorter module at least one tray for receiving electrically tested SIPdevices that do not pass electrical testing; removing each said SIPdevice that did not pass electrical testing from a first transportedtray of SIP devices in said sorter; and placing each said device thatdid not pass electrical testing into said at least one tray.
 6. A methodin accordance with claim 5, comprising: receiving in said sorter modulea second tray of electrically tested SIP devices; removing each said SIPdevice from said second tray that did not pass electrical testing; andplacing each said SIP device that did not pass electrical testingremoved from said second tray into said at least one tray for receivingelectrically tested SIP devices that do not pass electrical testing. 7.A method in accordance with claim 6, comprising: replacing each said SIPdevice removed from said second tray with a SIP device that did passelectrical testing from said first transported tray.
 8. A method inaccordance with claim 7, comprising: transporting said second tray fromsaid sorter module to an un-loader module when said second tray is fullypopulated with SIP devices that did pass electrical testing.
 9. A methodin accordance with claim 8, comprising: automatically stacking each saidtray received by said un-loader module
 10. A method in accordance withclaim 2, comprising: providing said identifying step by mapping theresults of the testing of all of said SIP devices in each said testedtray.
 11. A method in accordance with claim 1, comprising: providingsaid test hive with a first member configured to receive each said trayengaged by said hive; and including a plurality of alignment surfaces onsaid first member to provide alignment of each said tray engaged by saidhive to adjust for dimensional tolerance differences of each said tray.12. A method in accordance with claim 11 comprising: providing said hivewith a contactor assembly, said contactor assembly comprising a secondplurality of alignment surfaces each associated with a corresponding oneof said cells to provide alignment of each SIP device in each saidcorresponding one of said cells.
 13. A method in accordance with claim12, comprising: providing said contactor assembly with an insulatingplate member carrying said test contacts.
 14. A method in accordancewith claim 13, comprising: providing said contactor assembly with ametallic plate member carrying said second plurality of alignmentsurfaces.
 15. A method for testing System In Package (SIP) devices eachhaving a plurality of electrical contacts, comprising: receiving saidSIP devices in a JEDEC standard device processing tray having aplurality of SIP device receiving cells; orienting each said tray suchthat said contacts on each of said devices are in a predeterminedorientation to engage test contacts; providing a test hive having aplurality of test circuits corresponding in number to each of said cellsand providing a plurality of groups of said test contacts, each of saidgroup of said test contacts being coupled to one of said test circuitsand being oriented to engage said plurality of electrical contacts of aSIP device disposed in a corresponding one of said cells; moving eachsaid tray to a position proximate said test hive; causing relativemovement of said tray proximate said test hive whereby said test hiveengages said tray of SIP devices such that electrical connection is madesimultaneously by each of said groups of test contacts with saidelectrical contacts of a SIP device disposed in said corresponding oneof said cells; and simultaneously, electrically testing all of said SIPdevices in each tray engaged by said hive without removing said SIPdevices from said tray.
 16. A method in accordance with claim 15,comprising: causing relative movement of said tray proximate said testhive whereby said test hive disengages said tray of electrically testedsaid SIP devices.
 17. A method in accordance with claim 16, comprising:transporting each said disengaged tray of electrically tested SIPdevices to a sorter module.
 18. A method in accordance with claim 17,comprising: removing each electrically tested SIP device that did notpass electrical testing from each said transported tray.
 19. A method inaccordance with claim 18, comprising: replacing each removedelectrically tested SIP devices that did not pass electrical testingfrom each said transported tray with an SIP device that did pass saidelectrical testing.
 20. A method in accordance with claim 19,comprising: repeating said removing and replacing steps for eachtransported tray until said transported tray is fully populated with SIPdevices that pass electrical testing.